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Grain size effect on the thermal-induced martensitic transformation in polycrystalline Cu-based shape memory alloys

机译:晶粒尺寸对多晶铜基形状记忆合金热致马氏体相变的影响

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摘要

In Cu-based SMA alloys, the grain size (d) effect on the martensitic transformation temperature was investigated for a wide range of d. Specimens were prepared by different heat treatments in order to create a range of grain sizes, from about 500 nm (ribbons and tapes obtained by rapid solidification techniques) up to 6 mm diameter single-crystals (grown by the Bridgman method). Information obtained from the literature was also included in the set of analyzed experimental data. The reduction of grain size shifts the forward transformation temperature downwards. These grain-size effects are observed in specimens with d below ∼ 100 μm, and become more pronounced for d below ∼ 20 μm. An empirical expression was obtained that describes the grain-size effect over the whole temperature range. The obtained curve differs considerably from the Hall-Petch behaviour reported in the literature by some other investigators.
机译:在Cu基SMA合金中,研究了在较大的d范围内晶粒尺寸(d)对马氏体相变温度的影响。通过不同的热处理来制备试样,以产生一系列的晶粒尺寸,从大约500 nm(通过快速凝固技术获得的色带和条带)到直径为6 mm的单晶(通过Bridgman方法生长)。从文献中获得的信息也包括在经过分析的实验数据集中。晶粒尺寸的减小使正向转变温度向下移动。这些晶粒尺寸效应在d小于约100μm的样品中观察到,并且在d小于约20μm时更为明显。获得了描述整个温度范围内晶粒尺寸效应的经验表达式。所获得的曲线与其他一些研究者在文献中报道的霍尔-帕奇行为有很大不同。

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